High density backplane connector family available from TTI

Ground contacts positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan connector to achieve low crosstalk and high through-put performance levels. Reliability is assured with a dual point of contact mating interface and compliant pin interface to the printed circuit board.

Featuring the reliable, redundant contact design on every single contact and with 10+ Gb/s performance, the connector range has 100Ω impedance for differential pair configuration, and several versions meeting standard card slot pitches. The Z Pack TinMan modular system in various column versions, right angle pin header (coplanar -3, -4, -5 pair) and vertical receptacles (parallel port -4 pair) has sequencing for ground and signal contacts, and is RoHS compliant.