Ventec has a broad portfolio of substrate materials to fulfil Teltonika’s wide-ranging production needs, including a selection of lead-free FR4 formulas, as well as advanced halogen free FR15.1 materials. In addition, Ventec’s low-loss materials cover a wide performance spectrum for efficiency-focused, high-speed networking and computing systems, and thermal substrates help maximise reliability in highly dissipative applications such as power conversion, and rapid EV charging.

Ventec to become primary PCB materials supplier for Teltonika is a post from: Electronic Specifier which is not allowed to be copied on other sites.

With a typical thermal conductivity of 8.0 W/m-K according to the ASTM D5470 test method, THERM-A-GAP PAD 80LO is a compressible thermal elastomer for conducting heat in gaps between a heat-generating surface like a semiconductor or battery and a heat-dissipating surface.

High-performance thermal gap pad offers very low oil bleed is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“We are thrilled to see El Capitan become the second AMD powered supercomputer to break the exaflop barrier and become the fastest supercomputer in the world. Showcasing the incredible performance and efficiency of the AMD Instinct MI300 APUs, this groundbreaking machine is a testament to the dedicated work between AMD, LLNL and HPE,” said Forrest Norrod, Executive Vice President and General Manager, AMD. “At AMD, we are driving the future of computing with leadership performance and capabilities that will continue to define the convergence of HPC and AI for years to come.” 

AMD powers world’s fastest supercomputer, again is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The initiative focuses on the repair, reuse and recycling of faulty parts to extend their life and help reduce waste and conserve resources that would otherwise be used to manufacture new parts.

ABB circularity programme reduces industrial electronic waste is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Over the three-month period, there was a noticeable rise in identity-based attacks, particularly with a focus on stealing credentials, which accounted for 25% of incident response engagements. These types of attacks have become easier to execute, often using readily available tools.

Cisco reveals top cybersecurity threats trends is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Phase and amplitude stability with flexure is possible due to the optimized construction of Samtec’s orange Nitrowave cable. The inclusion of an interlayer enables consistent electrical performance throughout the cable’s life span while the low-density PTFE dielectric material ensures mechanical robustness. Flex life was tested to 400,000 cycles (with unrestrained flexing) and torque life to 1,000,000 cycles (+/- 90-degrees).

Samtec release Nitrowave LL043 series microwave cable assemblies is a post from: Electronic Specifier which is not allowed to be copied on other sites.

As the highest performance device within the fifth-generation (Gen 5) R-Car Family, the R-Car X5H directly addresses the growing complexity of Software-Defined Vehicle (SDV) development. These challenges include optimising compute performance, power consumption, cost, hardware and software integration – while ensuring vehicle safety. By tightly coupling application processing, real-time processing, GPU and AI compute, large display capabilities, and sensor connectivity on a single chip, these devices enable a new class of automated driving, IVI and gateway applications.

Renesas unveils automotive multi-domain SoC on 3nm process is a post from: Electronic Specifier which is not allowed to be copied on other sites.

With AI and advanced security becoming essential across all market segments globally, RED Semiconductor's VISC technology paves the way for their widespread adoption by making computing faster and more efficient. RED’s initial commercial projects include a healthcare application for AI in advanced cancer therapy monitoring, and the industry-wide applicability of post-quantum cryptography.

RED Semiconductor to join Silicon Catalyst Incubator is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The new connectors are engineered with a clamp/solder attachment, ensuring a secure and durable hold. This is essential for maintaining optimal performance in RF systems. Whether used in telecommunications, aerospace or defence, they offer versatile solutions for industries that require precision in high-frequency operations. The 50-ohm impedance provides minimal signal loss, and the wide frequency range is suitable for both existing and new installations.

Durable new high-frequency connectors is a post from: Electronic Specifier which is not allowed to be copied on other sites.

These new 200 V MOSFETs deliver the lowest on-state resistances, enhancing and complementing the existing Littelfuse X4-Class Ultra Junction family portfolio. Compared to the existing state-of-the-art X4-Class MOSFET solutions, these MOSFETs offer up to ~2x higher current ratings and RDS(on) values up to ~63% lower.

Littelfuse junction X4-Class 200V power MOSFETs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The XJLink-PF40 is designed to handle the challenges of complex, high-density circuit boards, making it an ideal tool for PCB engineers from prototype debug to manufacturing test. With up to eight JTAG TAPs over 40 I/O pins, the XJLink-PF40 enables multiple test access points to one unit under test (UUT), expanding test coverage for the most demanding applications.

XJTAG previews new XJLink-PF40 JTAG controller at electronica 2024 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Designers can select a suitable power solution based on their requirements. The IGBT 7 devices are offered in standard D3 and D4 62mm packages, as well as SP6C, SP1F and SP6LI packages. Many configurations are available in the following topologies: three-level Neutral-Point Clamped (NPC), three-phase bridge, boost chopper, buck chopper, dual-common source, full-bridge, phase leg, single switch and T-type. Devices are available with voltages ranging from 1200 to 1700V and current ranging from 50 to 900A.

Introducing a wide portfolio of IGBT 7 power devices is a post from: Electronic Specifier which is not allowed to be copied on other sites.

An STM32G071CB microcontroller, which hosts the ST proprietary IO-Link demo stack and the application software, handles system control and diagnostics, communicating with the transceiver and low-side switch.

IO-Link actuator board from STMicroelectronics is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The latest update of KontronOS offers the option of securely installing and updating native applications in addition to Docker containers, while the subsystem remains in read-only mode. This ensures a significantly higher level of security, because the system core remains impenetrable. The KontronOS update function includes both the operating system and customer applications. This provides a flexible and secure environment for the widest range of applications. The integration of this new functionality makes KontronOS an even stronger platform for the secure operation of device fleets over the long term. In conjunction with the remoting solution, updates and maintenance can also easily be carried out remotely.

New version of KontronOS expands susietec IoT bundles is a post from: Electronic Specifier which is not allowed to be copied on other sites.

These next-generation interface and memory technologies access and move data rapidly and efficiently between processors and accelerators. CXL 3.1 and LPDDR5X help unlock more memory resources faster to address the growing real-time processing and storage demands of data-intensive applications in data centre, communications, test and measurement, and aerospace and defence markets. 

AMD announces Versal Premium Series Gen 2 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Richardson Electronics, Ltd. will continue to focus on the GeneSiC product line, expanding from North America into EMEA. This includes Navitas’ latest family of Gen-3 Fast MOSFETs, delivering a high-speed, cool-running performance that ensures up to 25°C lower case temperatures and up to 3x longer life than alternative SiC products. This enables unprecedented, industry-leading levels of performance, robustness, and quality.

Navitas and Richardson Electronics expand partnership to EMEA is a post from: Electronic Specifier which is not allowed to be copied on other sites.

MIPS develops high-performance RISC-V CPU IP for AI, automotive and general-purpose computing. By pre-integrating Arteris network-on-chip IP, including Ncore cache coherent NoC IP and FlexNoC IP with the MIPS P8700 processor core clusters, the two IP providers demonstrate the interoperability and performance of the joint solution. Customers can confidently leverage the silicon-proven solution demonstrated by a pre-verified reference platform supported by both Arteris and MIPS.

Arteris and MIPS partner on high-performance RISC-V SoCs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Pico Technology's unique Sampler-Extended Real-Time Oscilloscope (SXRTO) technology combines the advantages of traditional real-time acquisition with sampling oscilloscope capabilities, offering engineers the best of both worlds. This means the scope can trigger directly on the signal and can also record pre-trigger data, while also achieving the extremely high time and amplitude resolution of a sampling scope.

Pico Technology launch 25GHz sampler extended real-time oscilloscope is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The launch of the LTDC-X3 builds on ScioSense’s position in the general market for TDCs, which it has established through its products’ high accuracy and precision, and their easy integration into a host system.

New high-speed, 20ps time-to-digital converter is a post from: Electronic Specifier which is not allowed to be copied on other sites.

All three devices in the new nRF54L Series integrate a 2.4 GHz radio and MCU functionality, including CPU, memory, and peripherals, into a single ultra-low power chip, supporting applications from simple, high-volume products to more demanding and advanced designs. Key applications include wearables, smart rings, gaming controllers, HID devices, as well as medical devices, smart homes, and Industrial IoT products. The nRF54L15 is well-suited for more demanding applications, while the nRF54L10 and nRF54L05 target high-volume applications such as smart tags, electronic shelf labels, asset trackers, and other cost-sensitive IoT devices.

Nordic launches next generation of wireless SoCs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Historically, engineers developing cable assemblies have had to create their designs, place multiple orders for connectors and cables, put everything together manually and then spend time testing and troubleshooting. The easy-to-navigate Harwin Cable Configurator, which is fully integrated into Harwin’s automated processes, now allows engineers to quickly develop fully functional configurations that are guaranteed to be to specification and that can be supplied with very short delivery times.

Harwin unveils advanced interactive cable configurator is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“Anritsu is thrilled to become the inaugural Test & Measurement instrument vendor in the OpenROADM MSA, comprising service providers and vendors. The OpenROADM MSA Group is committed to the open evolution of network management and vendor interoperability. We eagerly anticipate collaborating on network orchestration, which will enable us to control and monitor the quality of the entire network. Additionally, we are excited about the prospect of introducing test & measurement innovations facilitating network fault detection and causal analysis,” says Tadanori Nishikobara, Marketing Director of the Service Infrastructure Solutions Division at Anritsu Corporation.

Anritsu joins OpenROADM is a post from: Electronic Specifier which is not allowed to be copied on other sites.

LEM’s new sensor takes away the worries of designing-in solutions within constrained automotive environments while also speeding up design architecture by being ISO26262 Automotive Safety Integrity Level B (ASIL B) ready. More importantly, the new RCM type B sensor is leading the way in this rapidly developing sector by enabling designers to react quickly to the new ISO5474 Part 2 standard for AC power transfer. The standard focuses on electrically propelled road vehicles and outlines the functional and safety requirements for power transfer between the vehicle and an external electric circuit using AC. Part of a series that operates in conjunction with ISO5474 Part 1, the new standard covers conductive charging requirements for modes 2 and 3 according to IEC 61851-1, reverse power transfer through on-board standard socket-outlets or EV plugs, and voltages up to 1000V AC.

LEM launch bi-directional automotive RCM type B sensor is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The RDM Series MIMO antennas support a wide range of frequencies from 690MHz to 5.85GHz, including LTE, Wi-Fi, GPS, GNSS, LoRa and more. The series includes antennas with features such as IP67 waterproof ratings, and MineProx proximity detection system for use in underground mines, ensuring they are built to withstand harsh environmental conditions.  

Raltron RDM series of MIMO antennas is a post from: Electronic Specifier which is not allowed to be copied on other sites.

In a highly competitive global environment where time-to-market can often make the difference between product success and failure, sourcing a reliable and efficient rapid prototyping laboratory is paramount. Saving time early in the development process can help companies achieve a faster return on their R&D investment. Rapid prototyping also encourages collaboration and constructive dialogue between project stakeholders.

New rapid prototyping laboratory from Parker Chomerics is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Neurological disorders impact over a billion people globally and pose a significant social and economic burden. Current treatments, especially pharmaceuticals, are often ineffective or fail to provide long-term solutions. With drug development becoming increasingly costly and less productive, many patients are left without effective care options. Neural implants offer a promising alternative, yet traditional technologies remain bulky, power-intensive, and reliant on invasive surgeries that limit accessibility and increase patient risk.

MintNeuro secures £1m to advance semiconductor technology is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Among the advanced solutions on display will be the Koh Young Alpha HS+ 3D Automated Optical Inspection (AOI) System, known for its whole-board foreign material inspection, high precision, and AI-powered functionality. The Alpha HS+ streamlines setup and operation, ensures no escapes, and ultimately allows its users to drive up their production yields, making it an invaluable resource for the best in PCBA manufacturing.

Altus to showcase cutting-edge equipment is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The IQOV-116 series has a HCMOS output and boasts a range of features including high stability of ±20 ppb over a wide temperature range of -40 to 95 °C, low phase noise (-150 dBc/Hz typ @ 1 KHz), 3.3 V supply voltage and low power consumption at 230 mA steady state. It comes in three standard frequencies: 10.0 MHz, 19.2 MHz and 20.0 MHz, with other frequencies available upon request.

IQD introduces the OCXO IQOV-116 series at electronica 2024 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Combining three of the most critical wireless technologies into a compact, power-efficient module, the versatile MAYA-W4 meets the growing demand for reliable and secure connectivity. Whether enabling low-energy mesh networks for smart homes or providing high-speed Wi-Fi 6 connectivity for industrial tools, the MAYA-W4 offers unparalleled flexibility for developers and manufacturers. Its small size and robust design make it ideal for space-constrained applications, while its comprehensive global certifications ensure seamless deployment across regions.

u-blox launches tri-radio module is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The industry standard half and full brick packages both offer a high input voltage range of 180 to 400 Vdc and a broad operating temperature ranging between -40 and 100 °C, making them suitable for harsh environments. The converters provide comprehensive protection features, including over-current, over-temperature, over-voltage, short circuit, and input under-voltage protections. In addition, they meet EN 61373 and EN 45545-2 standards to ensure the highest level of safety possible.

CUI release high-performance DC-to-DC converter is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Here are our top stories:

Top 10 stories from electronica 2024 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The acceptance criteria for functional safety are fail-safe (the ability to return to a safe state in the event of a failure or malfunction), fail-operational (the ability to continue operation even in the event of a failure or malfunction), and fail-degraded (the ability to continue operation with decreased functionality). In the past, the conventional method of achieving fail-safe functional safety was to use a microcontroller (MCU) together with a high performance IC called an "analog front-end" (AFE) to monitor automotive battery overcharge and over discharge conditions.

ABLIC launches S-19193 automotive battery monitoring protection ICs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Compared to three independent antennas, OMNIA mXTEND provides extra degrees of freedom, requiring a single clearance area while enabling superior long-range connectivity performance across multiple frequencies, making it suitable also for remote monitoring applications.

Ignion launches OMNIA mXTEND for IoT antenna integration is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Longevity is a significant pain point for customers in industries such as medical, military, and robotics. Can you elaborate on why this is so critical?

Longevity is essential because our customers need products with lifespans of at least seven to 15 years. In industries like medical, it can take two to three years to secure FDA certification for a device using our computing module, which is the ‘brain’ of their system. This certification process ensures safety for patients but also means that any changes to the computing hardware after certification would require a partial re-certification – a costly and time-consuming process. The same applies to industries like avionics, military, robotics, and automotive, where safety certifications are equally stringent. Stability in the bill of materials and ensuring no design changes during the product’s lifecycle are paramount.

Q&A: simplifying embedded computing with congatec is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Key upgrades in OSM Specification 1.2

OSM Specification 1.2 introduces several targeted updates that extend the flexibility and functionality of the leading standard for soldered-on modules. The primary focus of this revision has been on expanding and optimising individual interfaces to offer developers more versatile integration options, including among others:

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The product's introduction, led by Managing Director Phillip Wilson, garnered significant attention from radar industry professionals at EuMW who witnessed live technical demonstrations.

Slipstream unveils ASTRO at European Microwave Week 2024 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The recent agreement sets forth the terms of the collaboration, building on Clea’s availability across all NXP silicon and native integration into NXP’s official Linux and Zephyr BSPs. This enables NXP’s customers to quickly access Clea’s IoT data and device management features, providing device manufacturers with a seamless end-to-end solution for building IoT applications and deploying AI models at scale. By combining SECO’s software expertise with NXP’s hardware and secure Cloud services strengths, this synergy is expected to accelerate innovation, foster future growth, and expedite product development and market entry for customers.

Partnership agreement between SECO and NXP is a post from: Electronic Specifier which is not allowed to be copied on other sites.

SolderKing’s stand will feature a selection of its most advanced products, including the SK P2-5 SAC305 Solder Paste, designed specifically for demanding lead-free applications. This advanced formulation delivers reliable performance on complex finishes like OSP, ENIG, Ag, Sn, and HASL, tackling key challenges such as void reduction and stencil performance. The paste leaves minimal residue, reducing the need for post-soldering cleaning, and its compatibility with both air and nitrogen reflow systems ensures flexibility and consistent results across various assembly processes.

SolderKing to bring innovative soldering solutions is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Field based engineers need precise mmWave measurements to advance modern wireless communications and radar systems. This is critical when it comes to 5G, 6G, aerospace and defence and automotive radar transmission/receiving tests. However, mmWave signals are highly sensitive to obstacles, weather conditions, and interference. Understanding their propagation characteristics through precise measurements helps engineers design more efficient networks and radar systems, improving coverage, and enhancing reliability.

Keysight’s FieldFox introduces portable millimetre-wave is a post from: Electronic Specifier which is not allowed to be copied on other sites.

TNC and RP-TNC connectors optimised for micro-coax cable types are manufactured with nickel-plated, brass bodies and gold-plated, beryllium copper or brass contacts. They are designed with a hex shaped coupling nut which allows for a wrench to be used for easy tightening and untightening and available in straight and right-angle plug and jack configurations. Bulkhead mount versions are also available.  

Improved connectivity solutions from Amphenol RF is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“As one of the world’s largest medical grade power supply suppliers, Advanced Energy has a history of creating technologies that simplify and speed the design and approval process for medical equipment designers,” said Shrinidhi Chandrasekharan, Advanced Energy’s SVP, Medical Products. “The COMPAMED fair during MEDICA 2024 is an important event for showcasing our latest innovations and proprietary technologies to engineers and developers that are leading future medical equipment advances.”

Advanced Energy power technologies at MEDICA/COMPAMED 2024 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“In highly automated fabs, even minor carrier delivery issues can lead to costly downtime. Our E84 PIO Box is designed to rigorously validate nominal and error cases, ensuring seamless operations and fast recovery, benefiting both equipment manufacturers and facilities alike,” explains Marc Engel, CEO of Agileo Automation. “Early adopters have seen significant improvements in overall equipment software quality and now approach each software update with greater confidence, backed by consistent testing results.”

Agileo Automation launches E84 PIO Box is a post from: Electronic Specifier which is not allowed to be copied on other sites.

New AnalogPAK SLG47011 – low power device with 14-bit SAR ADC

Renesas’ new SLG47011 AnalogPAK device delivers a new level of performance for configurable analog integrated circuits. It includes a rich set of digital and analog features including programable multichannel 14-bit SAR ADC with Programmable Gain Amplifier (PGA). The SLG47011 also has flexible, user-defined power saving modes for all macrocells that enable designers to switch off some blocks in sleep mode and therefore reduce power consumption to the µA level.

Renesas AnalogPAK programmable mixed-signal ICs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The study comes at a critical moment as the world confronts a persistent ‘implementation gap’ between climate targets and results. While countries, companies, and other actors continue to set net zero targets – including a 23% rise in company net zero targets over the last year – global emissions also continue to rise. As countries look to submit new pledges under the Paris Agreement next year, it is vital they underpin top-level targets with concrete regulations and policies to ensure implementation.

New study shows net zero regulations have surged worldwide is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Initially, the adoption of digital tools like electronic navigation systems opened up basic vulnerabilities, inviting relatively unsophisticated cyber incidents. These early breaches, often accidental or opportunistic, underscored the industry’s lack of cohesive strategies and robust defences against emerging cyber threats.

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MMB541

"The MMB541 represents our commitment to innovation and high-quality industrial-grade solutions,” said Wayne Chung, the product manager of the AIoT Team at Axiomtek. "With its cost-effective design, the MMB541 simplifies the development of custom AI and automation systems by providing ample I/O interfaces and expansion capabilities, making it easy to integrate GPU cards and other accelerators for enhanced performance. Engineered for versatility, this motherboard can handle applications ranging from AI workstations to complex automation tasks while ensuring the durability and stability needed for long-term industrial use. The MMB541 empowers our customers to build efficient, scalable solutions tailored to today’s data-intensive environments."

Axiomtek announces the MMB541 new micro ATX motherboard is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Andrea Bricconi, Chief Marketing Officer at CGD says: “By combining industry-leading solutions from our two technology-strong companies in this EVK, we are enabling the development of compact, energy-efficient systems with high power density. Unlike other GaN implementations, ICeGaN technology easily interfaces with Qorvo’s PAC5556A motor control IC for seamless high performance in BLDC and PMSM applications.”

CGD and Qorvo collab for motor control solutions is a post from: Electronic Specifier which is not allowed to be copied on other sites.

In the interest of getting this functionality to our Mac / ARM users as early as possible, we are offering the 9.0.1 software as a feature-complete Beta to gather feedback before final validation. It is available as a download from the Audio Precision website for customers holding licenses valid for APx500 v9.0.

Audio Precision new APx500 Software with ARM CPU support is a post from: Electronic Specifier which is not allowed to be copied on other sites.

This year will also focus on demonstrating emerging tech innovations, in future-orientated strength areas like quantum, semi-conductors, space and artificial intelligence.

Scotland’s tech showcase partners with European Tech Tour is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Additionally, the conversation explores the GaN-based TIDA-010938 single-phase inverter for energy storage applications, focusing on how GaN technology enhances efficiency and reduces design size.

Energy infrastructure applications featuring real-time MCUs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

After four days at the trade fair, Dr. Reinhard Pfeiffer, CEO of Messe München, reflects on a very positive outcome: “For 60 years, electronica has been the central meeting place for the global electronics industry. This year’s trade fair here in Munich, a leading technology hub, was once again an impressive demonstration of the industry’s innovative strength. In the halls, visitors were able to see firsthand how future technologies are already taking shape – from intelligent energy solutions to smart mobility – and the vital role the electronics industry plays in making this happen.”

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GÖPEL Electronic at electronica 2024 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Additionally, the conversation covers ADI’s new magnetic reference design, which makes it easier for users with limited magnetic design experience to integrate the ADMT4000.

Introducing the ADMT4000 - world's first single chip multiturn position sensor is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Commenting on how the week has gone, West said: “Attending electronica this year has been a truly exciting experience for Electronic Specifier. It’s been fantastic to connect with industry leaders and showcase what we’ve been working on. I’m particularly proud of our Women in Tech Forum, which highlighted the incredible talent and innovation women bring to the electronics industry.”

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Solving existing challenges with innovative design

Traditional USB-C chargers split power across multiple ports, with a maximum of 140W from a single port. This limitation restricts the usability of USB-C for high-power devices like gaming laptops, monitors, and domestic appliances. Conventional Boost PFC+LLC designs are often noisy, expensive, and unsuitable for variable output voltages or fluctuating loads. Pulsiv’s solution, powered by OSMIUM technology, enables flyback topology at higher power levels, addressing these challenges while simplifying compliance.

Pulsiv at electronica: 240W output from a single USB-C port is a post from: Electronic Specifier which is not allowed to be copied on other sites.

It also discusses the strength of 3PEAK’s global fab partnerships, its quality standards, and compliance measures that meet industrial and automotive requirements.

3PEAK's analog product portfolio focus for industrial and automotive markets is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Key topics include RFbeam’s approach to research and development, the motivation behind the V-LD1’s creation, and the technological advancements that enable its millimetre-level accuracy.

RFbeam's V-LD1 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

On-chip processing levelling up the game

At the heart of this new product offering is the embedded processor which enables on-chip processing for improved performance and lower overall power consumption. Designed for IoT and robotics applications, the device is capable of obstacle avoidance, soft surface detection, liquid level measurement, and proximity/motion sensing.

TDK’s new ultrasonic ToF sensor at electronica 2024 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Quectel's high precision GNSS modules and antennas is a post from: Electronic Specifier which is not allowed to be copied on other sites.

What is CAN Bus?

CAN Bus operates as a serial communication protocol that allows multiple devices, or “nodes,” to communicate in real time over a shared data line. Unlike conventional point-to-point wiring systems, CAN Bus utilises a multi-master structure, meaning each node can send and receive data independently, optimising communication efficiency and preventing data collisions. It employs differential signalling (CAN High and CAN Low) to enhance noise immunity, making it ideal for electrically challenging environments. Additionally, CAN Bus is designed with built-in error detection mechanisms, such as cyclic redundancy checks (CRC), which ensure reliable communication by identifying and correcting errors in transmitted messages.

Next-gen industrial efficiency: Cervoz CAN Bus expansion solutions is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“The satellite missions Grace, Grace Follow-on and previously GOCE have provided really valuable data for calculating the Earth’s gravity field. However, the long-wavelength of the gravity field, which covers masses of continental size, can not be resolved very well by using these missions,” explained Sandro Krauss from the Institute of Geodesy at TU Graz. 

Laser technology tackles space debris is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Stoermann noted: “Eighteen months ago, many people recognised ChatGPT by name but were unclear about its applications. Today, AI is fundamentally reshaping technology landscapes, especially through data collection and memory management in Edge and endpoint scenarios.”

Series 16 – Episode 8 – AI at the Edge: memory’s role in a data-driven future is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The forum, which was sponsored by Rand Technologies, Component Sense, and Littelfuse, all of whom are advocates for inclusivity in the industry, considered how more opportunities can be created for women as well as some of the challenges holding them back. Speakers discussed everything from using data to measure true progress through to acknowledging the ‘elephants in the room,’ emphasising that real change starts with honest conversations.

Women at electronica 2024 leading change through inclusion and data is a post from: Electronic Specifier which is not allowed to be copied on other sites.

To learn more about this, Electronic Specifier’s Harry Fowle spoke with Henrik Mannesson, General Manager of WW Grid Infrastructure & Industrial Systems at Texas Instruments.

TI highlight energy infrastructure in its sustainability-focused electronica 2024 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Industrial sustainability is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Wireless embedded firmware is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Ezurio's Canopi portfolio is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The Arduino strategy for 2024/2025 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

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Each entry was placed into one of three categories: Power Product, Test & Measurement Product, and Electromechanical Product.

Electronics Excellence Award winners at electronica 2024 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Molex's portfolio of industrial solutions is a post from: Electronic Specifier which is not allowed to be copied on other sites.

GaN and the future of untethered robots is a post from: Electronic Specifier which is not allowed to be copied on other sites.

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Since 1952, the Archives Unit of the European Parliament has been responsible for preserving, managing, and processing all documents produced or received by the Parliament. Traditionally, the primary challenges for archivists have included making these vast archives searchable and ensuring easy access for all users. However, generative AI has revolutionised this landscape, transforming how archivists and researchers can navigate the extensive documentation.

EU Parliament expands archive access with Anthropic’s Claude is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The device prevents damage to the load by limiting the high inrush current and ensures minimal losses during operation due to its low R _DS(on).

electronica 2024: Linear FET enables safe hot-swap is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Electronic Specifier with the President of DigiKey at electronica 2024 is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The rapidly expanding xEV market is driving the demand for power semiconductors, among them SiC SBDs, that provide low heat generation along with high-speed switching and high-voltage capabilities in applications such as onboard chargers. Additionally, manufacturers increasingly rely on compact surface mount devices (SMDs) compatible with automated assembly equipment to boost manufacturing efficiency. Compact SMDs tend to typically feature smaller creepage distances, fact that makes high-voltage tracking prevention a critical design challenge.

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Key topics include how this modem addresses time-to-market and cost concerns, offering distinct benefits to IoT end customers. It explores the modem’s applications across various IoT use cases and outline the best starting points for potential customers, including evaluation kits available through Murata’s distribution partner, DigiKey.

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The conversation concludes with insights into how Industrial Ethernet contributes to Industrial Internet of Things (IIoT) and enterprise connectivity, as well as the ways it addresses key challenges faced by automation engineers.

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Innovative automotive applications based on piezoceramic materials is a post from: Electronic Specifier which is not allowed to be copied on other sites.

The conversation highlights Kingston’s embedded solutions, with emphasis on data integrity and reliability in harsh environments, as well as its industrial SSDs and their essential features. It also discusses the flexibility provided by various SSD form factors, Kingston’s approach to ensuring security, and the lifecycle management and long-term support customers can expect from these solutions.

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To learn more about this collaboration, Electronic Specifier’s Harry Fowle spoke with Rudi De Winter, CEO of X-FAB, on what this collaboration means for the future.

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Additionally, it looks at Flecto, a new BBi portfolio connector, and how it meets the data and power demands of high-performance applications, concluding with why Harwin’s connectors are a valuable choice for engineers.

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Key topics include safety, reliability, and efficiency in EV charging, the sustainability of TDK’s capacitor solutions, and the role of its temperature and pressure sensors in enhancing heat pump systems for both commercial and residential applications. The conversation concludes with TDK’s priorities for future product improvements and innovations to support the evolving green energy market.

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The ability to simulate electromagnetic fields is pivotal in studying a range of material characteristics that are otherwise difficult to replicate on quantum hardware. With this new technique, researchers can investigate properties like conductivity, magnetization, and polarization, providing insights into the underlying physics of materials that could lead to innovations in electronics, such as enhanced semiconductors, insulators, and superconductors. These advancements could contribute to the development of faster, more powerful, and energy-efficient devices.

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The new micropower magnetic switches and latches, the APS11753 and APS12753, redefine position sensing with higher sensitivity options for enhanced air gap tolerance,  and ultra-low power consumption using 50% less power than our existing micropower  products. This makes them well suited for challenging battery-powered applications in medical, consumer and industrial markets. 

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With up to eight JTAG TAPs over 40 I/O pins, the XJLink-PF40 enables multiple test access points to one unit under test (UUT), expanding test coverage for the most demanding applications. The controller offers four voltage domains - each connector can run in a different voltage domain.

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Chuck Cimino, Senior Product Manager at Lake Shore Cryotronics, explaines: “The new SMU-10 makes highly sensitive, selective AC detection technology used in research labs conveniently available to semiconductor design and test engineers. Using the familiar four-instruments-in-one SMU format, they can easily make extremely sensitive, low-noise measurements.”

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The new Serial NOR Flash devices are designed to address the growing demand for higher-density memory solutions in computing, consumer electronics, communication, and IoT applications. They support Single, Dual, and Quad I/O SPI and QPI interfaces and offer fast read frequencies up to 166 MHz for 128Mb devices and 133 MHz for 256Mb and 512Mb devices. Additionally, these devices provide uniform 4KB, 32KB, and 64KB erase capabilities; program/erase suspend and resume functions; and endurance exceeding 100,000 program/erase cycles.

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Meet the Treo Platform

At its core, the Treo Platform is built on a Bipolar-CMOS-DMOS (BCD) process technology that operates on a 65nm node. This supports a wide voltage range of 1-90V as well as operating temperatures of up to 175°C. Thanks to this impressive temperature tolerance, “things can become even smaller whilst maintaining the same performance,” describes Appeltans, which massively improves integration.

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Specific examples of connected drug delivery devices featuring Littelfuse technologies are discussed, followed by a look at emerging trends and how the company is positioning itself to address future demands.

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Additionally, the discussion touches on emerging trends in power design, concluding with insights into Würth's partnership with DigiKey and its impact on customers.

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With the R&S RTB 2, Rohde & Schwarz introduces several important updates that further enhance the instrument’s functionality and versatility.

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The floating high-side driver in these ICs can operate from bus voltages up to 120 V and use a bootstrap supply with an integrated diode, features which simplify overall system design and help to reduce PCB size. They can deliver up to 4 A (peak) source and 5 A of sink current to guarantee short rise and fall times even for heavy loads. The gate driver has a low 13 ns delay and offers excellent channel-to-channel delay matching of only 1 ns. These delays are significantly lower than for similar competing gate drivers and help to minimise dead-time by maximising switching duty-cycle. 4 ns rise and 3.5 ns (typical) fall times help to deliver higher efficiency and support high frequency and fast system control. These gate drivers accept input control signals complying with both TTL and CMOS logic levels.

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It examines 3M’s unique materials supporting the miniaturisation of AI hardware and how it balances conductivity and durability to optimise performance and longevity. Sustainability efforts, including eco-friendly materials and processes, will be highlighted, along with 3M’s vision for overcoming future challenges in AI hardware development.

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The new X5M007E120 uses a manufacturing process that reduces on-resistance per unit area by up to 30%. Unlike existing methods that utilise a striped-pattern construction, the new devices arrange the embedded Schottky barrier diodes (SBDs) in a check-pattern to achieve lower on-resistance.

Toshiba ships early samples of 1200V SiC MOSFETs is a post from: Electronic Specifier which is not allowed to be copied on other sites.

“Our new product distribution centre offers faster, more efficient, flexible and reliable service for TI’s customers in Europe to meet semiconductor demand now and in the future,” said Stefan Bruder, President of Texas Instruments Europe. “Our new centre in Dreieich is the latest addition to TI’s global product distribution network which, combined with our convenient purchasing options, provides an improved customer experience from product selection to shipment.”

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SECO will leverage its hardware design expertise to bring a 10.1-inch Human-Machine Interface (HMI) solution to market, based on Raspberry Pi's fifth-generation Compute Module (CM5) and supporting Raspberry Pi OS to simplify integration. SECO and Raspberry Pi will collaborate on hardware development to offer customised solutions tailored to industrial clients’ specific needs.

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There are many advantages to a VCSEL over a conventional edge emitting diode.  The emission from a VCSEL is vertical, perpendicular to the top surface.  For this reason, VCSELs can be tested and characterised during production, allowing for a more controlled process and higher yield. Additionally, VCSELs can be processed in higher densities on semiconductor wafers, further improving yield.  These factors result in superior performance versus cost.

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Andrea Bricconi, Chief Marketing Officer at CGD: We are super excited at this first result of our partnership with IFPEN. 800 VDC supports the 800 V bus which is being increasingly adopted by the EV industry. By addressing automotive and other high voltage inverter applications with energy-efficient ICeGaN-based solutions we are delivering on CGD’s key commitment – sustainability.”

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The MBX Series boasts high heat pumping densities up to 43 W/cm2 with temperature differentials up to 82°C at an ambient of 50ºC. Ensuring efficient thermal management and precise temperature stabilisation, the MBX Series protects optoelectronics that operate in high-temperature environments including laser diodes, optical transceivers, LiDAR, Infrared Range (IR) Sensors, and high-powered Indium Phosphide (InP) VCSELs.

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A chance to win big

Each day of the show Electronic Specifier are giving away a pair of Bose headphones. All you need to do to be in with a chance to win is scan your badge at the stand – remember you need to be in it to win it!

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Associate Professor David Collins, Head of the Collins BioMicrosystems Laboratory at the University of Melbourne, commented on the approach’s advantages over current bioprinting technologies: “In addition to drastically improving print speed, our approach enables a degree of cell positioning within printed tissues. Incorrect cell positioning is a big reason most 3D bioprinters fail to produce structures that accurately represent human tissue."

High-speed 3D bioprinter: new opportunities for drug discovery is a post from: Electronic Specifier which is not allowed to be copied on other sites.

This broad frequency capability offers device makers the flexibility to select specific bands without size modifications – an essential benefit for the growing demands of complex, multi-radio applications.

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Wireless communication within battery packs enables robust and reliable transfer of battery cell information such as voltage and temperature measurements from one module to the battery management unit without the need for wiring.

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In the automotive industry, the accelerating shift towards software-defined vehicles means that underlying vehicle architectures increasingly rely on Ethernet-based communications. 

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Starting at only $35, the DART-MX91 is an ideal solution for cost-sensitive devices, catering to a wide range of embedded applications.

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This year’s SEMICON Europa is staged in conjunction with electronica.

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The EA-PSB 20000 Triple series is a 3-channel, bidirectional power supply and electronic load with energy recovery that delivers higher test coverage, density, and capacity across multiple channels within a single device.

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The new devices integrate an STM32G031 microcontroller, based on the Arm Cortex-M0+ core, which has the computing power to handle popular control algorithms, including six-step control and field-oriented control (FOC). FOC implementation can be sensored or sensorless, with one, two, or three shunts. Additional features that help simplify system design include a 12-bit ADC, internal voltage reference buffer, an advanced motor-control timer, and digital interfaces including I2C, USART, and SPI. Up to 32 general-purpose I/O pins (GPIOs), 64KB of Flash, and 8KB of SRAM give developers flexibility to host complex applications and innovate value-added features.

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“Engineers increasingly strive to design automotive and industrial applications that are more energy efficient and can make faster decisions, driving a need for more scalable processing power, expanded memory, and on-chip safety and security enablers,” said Amichai Ron, Senior Vice President, TI Embedded Processing. “For decades, our C2000 MCUs have been enabling manufacturers to measure and efficiently process real-world data. Today’s introduction of enhanced real-time performance and Edge AI in our C2000 portfolio will empower engineers to solve more complex problems and reach higher levels of system efficiency, safety and sustainability.”

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The E-Axle is a unit in EVs that combines a drive motor, a gear, and an inverter. By integrating multiple functions, the E-Axle system can reduce system size and weight, simplifying EV design. Renesas provided key components, including semiconductors and a reference design for the new 8-in-1 E-Axle system. Renesas also plans to deliver turnkey semiconductor solutions for various X-in-1 systems based on the reference design verified through this PoC. Armed with these solutions, developers can implement and evaluate X-in-1 systems instantly, accelerating EV development.

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Today’s increasing power demands in automotive, industrial, and AI data centre markets in parallel with stricter environmental regulations are driving a need for greater energy efficiency at the same time these industries are requiring greater performance and functionality in end applications. Additionally, low power devices such as medical wearables are becoming more sophisticated, requiring more intelligence and better efficiency to improve personal care and reduce device costs. This creates the need for highly integrated, advanced power and sensing solutions capable of delivering greater intelligence while simultaneously delivering greater energy efficiency across the entire power spectrum.

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Visionary exhibition experience: Welcome to CROSSROADS: Where the future begins

Samsung’s booth at electronica 2024 will provide an immersive experience that embodies the dynamic intersection of human imagination and cutting-edge technology. Visitors will experience firsthand how Samsung is shaping the future of innovation through semiconductor and display technologies. The exhibition will showcase multiple products and demos across various domains, demonstrating the company’s commitment to realising the true potential of AI and unlocking new possibilities in industries ranging from automotive to consumer electronics.

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With wafers containing over 100 circuit layers, even small failure rates in a single process can have a large impact on the final product. This makes precise process control essential for companies that manufacture advanced semiconductors. Engineered using the superior mechanical and electrical properties of fluoropolymer, Junkosha EPTFE Flat Cable allows the flat cables to be stacked on top of each other without needing dividers and shelves, reducing the overall size of the cable system. Additionally, unlike traditional flat cables, this innovative cable design offers a highly adaptable solution for equipment where space, flexibility, and performance are crucial. By tailoring the pitch to specific requirements, it enables manufacturers to achieve space savings and design optimisations while improving durability, functionality and overall system efficiency – a crucial advantage as device features continue to shrink to 2nm and below.

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Launched today, the newest tool in the suite—the Taoglas Antenna Integrator—enables users to preview their embedded antennas, including multiple or MIMO antenna systems’ performance in the concept phase of a project, accelerating time to market and helping to avoid potential issues with component placement inside the product.

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“Axiomtek’s CEM710 supports edge computing with IoT-centric features, including built-in AI acceleration, extensive I/O capacity, and hardware-based security. It offers high-bandwidth network and peripheral support, such as a 2.5GbE port, four 10GBASE-KR (10GbE) PHYs, and up to thirty high-speed PCIe 3.0 lanes, delivering true server-class connectivity at the Edge. The CEM710 is engineered for reliability in harsh environments, offering standard operating temperatures from 0°C to 60°C (32°F to 140°F) and extended ranges from –40°C to 85°C (-40°F to 185°F) when paired with an appropriate thermal solution. Its rugged design makes it well-suited for high-performance equipment and sealed fanless devices that require continuous operation in the harshest environments,” said Kevin Lin, Product Manager of the IDS Division at Axiomtek.

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For L2+ ADAS systems with AI Autonomous software stack, the MIPS P8700 can also offload core processing elements that cannot be easily quantised in deep learning and reduced by sparsity-based convolution processing functions, resulting in >30% better AI Stack software utilisation and efficiency.

MIPS releases first high-performance AI-enabled RISC-V automotive CPU is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Meeting industrial demands with resilience and connectivity

The HummingBoard i.MX8M IIOT SBC is engineered for demanding industrial applications, delivering resilience, expandability, and connectivity in a compact design. Built to withstand challenging conditions, it operates within a temperature range of –40 to 85°C, making it ideal for a variety of industrial settings.

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To maintain image fidelity, the acoustic hologram is fixed within the printing material, while a robotic arm moves the platform according to a pre-programmed algorithm.

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The Quartz Series also stands out for its robust power handling, capable of managing up to 40 watts average power during hot switching. Each switch in the series is built with failsafe actuators, and both 12-volt and 24-volt models are offered.

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PPPL Principal Research Physicist Igor Kaganovich explained: “This work is part of PPPL’s broader efforts to advance microelectronics by providing critical research into the materials and processes that could prove essential to ensuring a continued competitive advantage for the United States in this high-tech field.”

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So, how can this gap be tacked? Well, the Dyson Institute of Engineering and Technology aims to do just that, by creating a hybrid learning environment. They offer practical degrees, where theory is married with practicality to produce fully robust engineers which, they claim, are educated with a view that they will be working in roles that do not yet exist, solving problems that aren’t yet realised. Plus, it’s the start of a career with this renown brand.

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Reliable and versatile industrial computing solutions

The MPC-3000 panel PCs, powered by Intel Atom x6000E processors, offer exceptional versatility with six distinct series that feature screen sizes ranging from 7” to 15.6”. Designed for use in harsh industrial environments, these panel PCs come with advanced touchscreen functionality and sunlight-readable displays, and support wide-temperature operations, making them well-suited for a variety of outdoor applications. Whether deployed in oil and gas fields, marine operations, outdoor applications, or other demanding settings, the MPC-3000 panel PCs are reliable and efficient, even in tough conditions.

Moxa launches rugged MPC-3000 panel computers for harsh environments is a post from: Electronic Specifier which is not allowed to be copied on other sites.

Ronald Wilting, CEO of Forefront RF, said: "Securing this Series A funding underscores the strong confidence our investors have in Forefront RF's vision and market potential. With continued support from Foresight Group and BGF, and new partnerships with Octopus Ventures and Cambridge Innovation Capital, we're well-positioned to scale rapidly from engineering prototypes to mass production."

Forefront RF secures £16M to power next-gen connectivity solutions is a post from: Electronic Specifier which is not allowed to be copied on other sites.

With the UK’s AI assurance sector valued at £1 billion and projected to reach £6.5 billion by 2035, the platform is set to drive significant economic growth. As AI adoption increases, demand for assurance services will position the UK as a global leader in responsible AI.

UK Government unveils new AI assurance platform is a post from: Electronic Specifier which is not allowed to be copied on other sites.