Winbond Electronics has unveiled the W25N01KW, a 1Gb 1.8V QspiNAND flash solution for wearables and IoT devices.

Winbond’s customised ultra-bandwidth elements (CUBE) technology is engineered to meet the rapidly growing demands of AI applications on Edge platforms.

Winbond Electronics Corporation has unveiled an enabling technology for affordable Edge AI computing in mainstream use cases.

Winbond Electronics, a global supplier of semiconductor memory solutions, and Mobiveil, a fast-growing supplier of Silicon Intellectual Property (SIP), platforms, and IP-enabled design services, have announced a collaboration on a new IP controller targeting various applications such as automotive, smart IoT, industrial, wearables, TWS, wireless headsets, smart speakers, and connectivity.

Winbond has announced that its TrustME W77Q Secure Flash family has received the prestigious ISO/SAE 21434 international standard certification.

Winbond Electronics, a global supplier of semiconductor memory solutions, has announced the 8Mb W25Q80RV, the first of a new 3V RV series flash devices capable of high performance, low power, and available in small-form-factor for addressing the requirement of connected IoT edge devices used in industrial and consumer segments.

Winbond has announced the results of its sustainability performance along with aggressive goals and product development plans to expand that leadership in 2023.

Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium, the industry Consortium dedicated to advancing UCIe technology.

Security in IoT devices is a growing concern. Reports show that in the first half of 2021, there were 1.5 billion attacks on IoT devices. The main reason for these attacks and subsequent data breaches is the lack of security.   Currently, only around 4% of deployed IoT products having adequate security in place. Winbond looks at how the security of connected devices needs to be based on software and hardware resilience to not only prevent...

Security in IoT devices is a growing concern. Reports show that in the first half of 2021, there were 1.5 billion attacks on IoT devices. The main reason for these attacks and subsequent data breaches is the lack of security. Currently, only around 4% of deployed IoT products having adequate security in place. Winbond looks at how the security of connected devices needs to be based on software and hardware resilience to not only prevent cyber-a...

Winbond Electronics Corporation announced that its Flash Memory products will now support the low temperature soldering (LTS) process, which reduces Surface Mount Technology (SMT) temperature from 220~260oC in the lead-free process to ~190oC.

Security in IoT devices is a growing concern. Reports show that in the first half of 2021, there were 1.5 billion attacks on IoT devices. The main reason for these attacks and subsequent data breaches is the lack of security.   Currently, only around 4% of deployed IoT products having adequate security in place. Winbond looks at how the security of connected devices needs to be based on software and hardware resilience to not only prevent...

Winbond Electronics, a global supplier of semiconductor memory solutions, has announced that they had received the ISO/SAE 21434 certification from TÜV NORD for Road vehicles Cybersecurity Management System (CSMS), making them the world’s first memory vendor to receive the ISO/SAE 21434 standard certification for Road vehicles Cybersecurity Management System (CSMS).

Winbond Electronics Corporation has announced that its package 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction.

With SESIP level 2 certification, W77Q Secure Flash will provide connected devices with higher assurance by simultaneously requiring a vulnerability analysis and actual penetration testing on IoT platform design systems using Secure Flash to comply with security and functional safety standards.

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, together with Infineon Technologies, a world leader in semiconductor, microelectronics and IoT solutions, have announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwidth HYPERRAM 3.0.  

On the 27th of October Winbond held a webinar on the challenges and solutions of AI & automotive for code storage memory this featured a presentation on a varitey of topics and a live Q&A with Erica Lee and Mick Elliott an editor at Electronic Specifier

High performance memory is required for fast boot applications and better user experiences. Winbond will demonstrate several approaches to explain how to achieve higher data thru-put rate for instant boot and higher erase/program efficiency during OTA on AI and automotive application.Fast boot loaders for autonomous driving systems and instrument panel displays, AI training model and database storage systems, and over-the-air programming updates ...

Winbond Electronics has announced the official confirmation that its HyperRAM and SpiStack (NOR+NAND) can be operated with Renesas’ RZ/A2M Arm-based microprocessors (MPUs). Customers of the RZ/A2M can benefit from Winbond’s long-term supply for various types of external memory, including DRAM, NOR Flash, and NAND Flash which are currently the mainstream of embedded systems.

Winbond Electronics has announced it is expanding its total solution of SPI NOR Flash with the introduction of the new single die monolithic 1.8V 512Mb SPI NOR Flash that can support up to 166MHz standard/dual/quad SPI clocks.