Products

The Chomerics Division of Parker Hannifin has introduced THERM-A-GAP PAD 80LO, a high-performance thermal gap pad with low oil-bleed and migration characteristics.

Ahead of Black Hat MEA in Riyadh from 26-28 November 2024, Cisco released insights into key cybersecurity trends that emerged between July and September 2024.

Samtec has announced full production quantity availability of its LL043 Series Nitrowave high-performance microwave cable assembly.

Fairview Microwave has announced the launch of its new line of 2.92 mm, SMA, SMPM and 3.5 mm connectors, designed for 0.034 and 0.047 semi-rigid coaxial cables.

Littelfuse has announce the release of the IXTN400N20X4 and IXTN500N20X4 Ultra Junction X4-Class Power MOSFETs.

Power components are evolving to meet the increasing demands for higher efficiency, smaller size and greater performance in power electronic systems. To provide system designers with a wide range of power solutions, Microchip Technology announces its portfolio of IGBT 7 devices offered in different packages, multiple topologies, and current and voltage ranges.

ST has introduced an IO-Link reference design for industrial beacons and home-appliance alarms, delivered ready-to-use as a fully built board complete with protocol stack and application software.

Thanks to the expansion of the hardened Linux-based KontronOS, Kontron susietec IoT Bundles offer more flexibility for cross-industry IoT applications.

AMD announced the AMD Versal Premium Series Gen 2, an adaptive SoC platform designed to deliver the highest levels of system acceleration for a wide range of workloads.

Richardson Electronics, Ltd. and Navitas Semiconductor announced an expanded distribution partnership for next-gen silicon carbide (SiC) power semiconductors for Europe, the Middle East, and Africa (EMEA).