Design
High-performance thermal gap pad offers very low oil bleed
The Chomerics Division of Parker Hannifin has introduced THERM-A-GAP PAD 80LO, a high-performance thermal gap pad with low oil-bleed and migration characteristics.
Release of updated OSM Specification 1.2
The Standardization Group for Embedded Technologies (SGET) announced the official release of OSM (Open Standard Module) Specification 1.2, alongside the newly updated OSM Design Guide 1.1.
Audio Precision new APx500 Software with ARM CPU support
Audio Precision has announced the release of APx500 software version 9.0.1 Beta, now supporting ARM CPU architecture, commonly found in mobile and Apple silicon devices.
Start Your Next Project with the LAUNCHXL-F28P55X Development Kit!
LAUNCHXL-F28P55X is a low-cost development board for TI C2000 real-time microcontrollers series of F28P55x devices. Ideal for initial evaluation and prototyping, it provides a standardized and easy to use platform to develop your next application.
onsemi unveils the Treo Platform at electronica 2024
onsemi has unveiled its Treo Platform at electronica 2024, its most advanced analog and mixed-signal platform to date.
OMNIA mXTEND: transforming IoT design with triple-radio solution
Ignion continues to drive innovation in IoT connectivity with its latest addition to the Virtual Antenna portfolio, the OMNIA mXTEND.
Taoglas introduces the AntennaXpert suite of tools
Taoglas has introduced AntennaXpert, a suite of user-friendly, digital tools to streamline, simplify, and customise antenna design and integration.
MIPS releases first high-performance AI-enabled RISC-V automotive CPU
MIPS, a developer of efficient and configurable IP compute cores, announces the general availability (GA) launch of the MIPS P8700 Series RISC-V Processor. Designed to meet the low-latency, highly intensive data movement demands of the most advanced automotive applications such as ADAS and Autonomous Vehicles (AVs), the P8700 delivers accelerated compute, power efficiency, and scalability.
Ensuring a bright future for diamond electronics
Researchers are pioneering new methods for producing lab-grown diamonds while minimising carbon by-products like soot. These diamonds, however, aren’t intended for jewellery; they’re destined for advanced applications in future computers, optics, and sensors.
Infineon backs game-changing PCB software upgrade
RS, a global product and service solutions provider for industrial customers, has announced the release of its award-winning software, DesignSpark PCB version 12, backed by the support of Infineon, Germany’s largest semiconductor manufacturer.