Design

Safety is a paramount concern in electric vehicles (EVs). The high energy density of lithium-ion batteries, a typical choice in EVs, poses risks of failure if the operating conditions deviate from those for which the battery has been designed.

Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.

The Faraday Institution’s latest report on UK gigafactories finds that they could support 35,000 jobs by 2040, along with a further 65,000 in the supply chain, but warns that the UK is not moving quickly enough.

We’re thrilled to announce the worldwide availability of the CELUS Design Platform, our AI-assisted hardware design tool that’s empowering over 12,000 engineers across the globe.

SEGGER has expanded the capabilities of its debugger and performance analyser, Ozone, by adding semihosting support for debugging RISC-V applications.

For the first time, researchers at the University of California, Irvine, alongside international collaborators, have achieved atomic-scale observations of grain rotation within polycrystalline materials. These materials, fundamental to electronics, aerospace, automotive, and solar technologies, have long intrigued scientists due to their unique structural dynamics.

Researchers at the University of Michigan developed a knee exoskeleton, using readily available knee braces and drone motors, to alleviate fatigue in lifting and carrying tasks.

The future of space travel is seemingly changing by the day and a Coventry University academic is doing his bit to stay at the front of the space race.

DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: with the use of UV-curable moulding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimises the energy consumption.

KYOCERA has further developed its high-end ceramic Starceram N3000 P and has launched a new silicon nitride for the functional testing of next-generation microchips.